Please return to : Olaf Behnke ZEUS/F1  01a/O1.132    Tel. 3854
   or email  to   : obehnke@mail.desy.de,doris.eckstein@desy.de


   Request for a DESY Summer Student in 2013
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   Name : Karsten Hansen       email : karsten.hansen@desy.de     
  
   Tel  : 3343                 Room : 2a / 117
 
   DESY-Group/Experiment : FEC

 
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   Short description of the project the student should work on  :

   We are involved in the assembly of CMS barrel pixel detector 
   bare modules for the phase 1 upgrade. This includes the 
   automated in-house solder bumping and flip-chip technology. 





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   Physics / Computing/ Engineering  Content of the project :
   Involvement in the qualification of the in-house chip packaging 
   technology. For example, shear and pull testing, 4-wire 
   resistance probing, metallographic sample preparation, SEM and 
   optical microscopy as well as refining code (labview, matlab) for
   equipment and data analysis automation.



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  Special Qualifications expected from the student ( Computing,...) :
  

 
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  Other remarks :  



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   Supervisor(s) during the project (16/07/12 - 5/09/12) :
 
  
   Name: J. Hampe  Tel: 2584  email : jan.hampe@desy.de